[UPDATE] Dye-sensitized Solar Cells

Sony has been involved in developing technology for dye-sensitized solar cells for several years. Dye-sensitized solar cells are next-generation solar cells based on innovative technology. Unlike conventional silicon-based solar cells, dye-sensitized solar cells consist primarily of photosensitive dye and other substances. Dye-sensitized solar cells are able to generate electricity by converting energy from light absorbed by the dye. Since these solar cells can be produced from low-cost materials using simple manufacturing processes (such as coating and printing), overall manufacturing expenditures are expected to be comparatively low. Other advantages over silicon-based solar cells include the ability to use a variety of designs and colors and achieve high performance under indoor and low light settings. In addition, changes in the angle at which light hits the surface of the cells have minimal effect on performance. Such dye-sensitized solar cell advantages are expected to expand the range of use for solar cells, which are ideal for a variety of consumer-related applications in which conventional solar cells are unsuitable.

Sony commenced R&D in this field in 2001. In April 2009, a prototype module based on Sony's unique "Concerto Effect" dye-mixing technology set a world record for a dye-sensitized solar cell by achieving energy conversion efficiency of 8.4%. Aiming to launch commercial products in the near future, Sony has accelerated efforts to enhance the photovoltaic (light to electric energy conversion) efficiency and reliability of these cells and develop effective manufacturing processes.

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[UPDATE] Interviews with Engineers - 35mm Full-size CMOS Sensor

Equipped with the 35mm full-size CMOS sensor providing 24.6 effective megapixels, the a900 is Sony's flagship model for its a Series digital single lens reflex (DSLR) cameras. This camera was developed to meet the demands of photographers who want to take pictures with the same focal length and angle of field as can be achieved with 35mm film cameras. The CMOS sensor built into the a900 gives this camera the ability to capture subjects in minute detail. The imaging element has approximately 2.35 times the area of an APS-C size CMOS sensor, empowering photographers to create images with enhanced definition. The creators of this enlarged cutting-edge sensor had to overcome many challenges on the road to its development. We asked one of the engineers who worked on the sensor about the difficulties involved.

Our greatest challenge during the initial stages of development was controlling processing precision. Any loss of processing precision will cause color and sensitivity variations in a CMOS sensor. If you increase the size of a CMOS sensor, you also increase the risk of horizontal and vertical imperfections, and it becomes proportionately more difficult to maintain the necessary processing precision. However, some aspects of optical characteristics, such as color variations, do not become apparent until you actually produce a sensor. So we had to go through repeated cycles of simulation checking and prototype creation until we developed a sensor supporting the kind of imaging quality we were seeking.

Yield was a major issue at the manufacturing stage. The dominant factor influencing yield was the presence of sub-micron particles. Although the clean room in the manufacturing plant provides extremely advanced dust protection, the density of the imaging elements and the circuits and wiring around them is so high, that a single particle falling onto a sensor can short out the circuitry and render the element useless. We tend to think of particles as things that float around in the air, but in fact they can appear in unexpected places. For example, particles are sometimes produced when materials are transported.

We decided to design circuits that would be less vulnerable to particles. This approach was based on a concept known as "design for manufacturing" (DFM). DFM is a circuit design technology that takes into account problems arising from manufacturing technology. We devised an element and wiring layout for a full-sized CMOS sensor that allowed us to reduce vulnerability to particles from the design stage. A lot of effort went into production line improvements. For example, we installed production equipment made from materials that were less likely to produce particles. These measures brought about gradual improvements in yields.

During APS-C size sensor development, we also carried out manufacturing simulations for a full-size CMOS sensor, and we had a general idea of what to expect because of our work on pixel design, specification development and other aspects. However, when we took photographs with the prototype sensor, we noticed a problem. Noise that was imperceptible with an APC-C sensor was significantly expanded and became much more obvious.

A full-size CMOS sensor has a larger photosensitive area than an APS-C CMOS sensor, and care must be taken to ensure compatibility between the area around the field and the optical system. Light traveling through the center lens reaches the CMOS sensor in a roughly vertical direction. However, light that passes through peripheral areas of the lens follows a slanting path to the lens. This results in reduced sensitivity, color variation and other phenomena. To solve this problem, we reduced the distance to the photodiodes to ensure that peripheral light would also reach the image sensor, and we also improved the overall flatness of the chip. In a full-size chip, even minute differences in light wavelengths can cause major color variations, so enhancing flatness has remained an important priority.

This process required exquisite artisanship. The slightest change to the processing conditions would radically alter the characteristics of the chip. When the conditions were right, however, the chip seemed to respond to our efforts. It was as if we were working with a living thing.

Our goal was not to achieve optimal characteristics on a pinpoint basis, but rather to achieve the same characteristics consistently. This was extremely important from a manufacturing perspective. Our efforts to meet this requirement would result not only in manufacturing parameter adjustments, but also in major modifications to the entire manufacturing process.

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[UPDATE] Interviews with Engineers - Creating an IC Card with Optimal Security and Ease of Use

Sony's FeliCa provides enhanced security while also supporting high-speed data transmission and reception. Its creators had to overcome many challenges, including the development of an IC card without a built-in battery, and the implementation of reliable security measures.

The development of fundamental technologies supporting FeliCa began in 1988 after a major logistics firm approached Sony to develop an IC card system that would make the automatic sorting of packages a reality. Initially the developers decided to create a system that would use wireless technology to transmit unique IDs assigned to each package. The sorting system would read these IDs and sort packages by destination.

However, when a prototype tag capable of transmitting an ID was first engineered, the developers found that it would require not only an IC chip but also a thin laminated battery to supply power, as well as an antenna and various other components. The total cost was over 2,000 yen per unit. At this price, the tag would not have been suitable for use in managing a logistics environment where thousands of items need to be tracked. So, Sony was forced to abandon the idea of using the technology in a sorting system based on IC cards.

However, Sony continued to develop IC cards based on wireless technology. A key priority was solving the power supply problem, which had frustrated efforts to develop a logistics system for package deliveries. The CPU on an IC card needs electric power to operate, but a thin laminated battery would be too expensive. So Sony's engineers decided to use a reactive transmission system based on field-effect transistors (FETs), which have minimal power requirements.

Conventional transistors establish circuits by controlling the current outflow in relation to the input current. As long as conventional transistors are used, the circuits only exist while power is present. However, FETs produce signals by varying the input voltage. This allows them to establish operating circuits with infinitesimal amounts of power. With FET technology, it is possible to transmit data simply by modifying the resistance.

Today's FeliCa card has no battery, but at the time, the card still required an internal power source. However, these new advances opened the doors to development of an IC card that would operate using far less power than the original system design. The adoption of the FET approach in analog circuitry was a major step forward to the practical implementation of the FeliCa concept.

The development of FeliCa reached a major turning point in 1988. In that year, we learned that the JR Group's Railway Technical Research Institute was conducting studies on a ticketing system based on the use of IC cards. We thought it might be possible to use Sony's IC card technology in such a system, so we presented the Railway Technical Research Institute with our technological findings. However, the specifications required by the Institute were higher than we anticipated. They wanted a system capable of processing 60 people through a ticket gate per minute and a transmission time of 200ms or lower. The IC card we were developing at the time would not have been able to meet these requirements.

Another requirement stipulated by the Railway Technical Research Institute was that the IC card must operate without a battery. We had succeeded in reducing the card's power consumption, but we had not developed a totally batteryless card. However, we were aware that the number of cards used by a full-scale ticketing system adopted by the JR Group would be extremely large. Both JR and Sony reached the conclusion that a card without an internal power supply would be the ideal solution. This conclusion was based not only practical considerations, such as thickness and battery life, but also on environmental considerations, including the need to avoid the release of toxic substances at the time of disposal. Our first step toward the creation of a batteryless card was to switch to non-volatile memory (EPROM). By using the 13.56MHz frequency, on which it is legally permissible to transmit electric power, we were able to create a system capable of supplying power from the reader/writer without contact. The advantages of an IC card based on FET technology now became apparent. Because Sony had reduced the power requirements of its IC card by using FETs, it was relatively easy to create a card without an internal power supply.

The effective distance stipulated for radio waves emitted by an IC card is at least 10cm and no more than 20cm. Ticket gates are used by large numbers of people, and the system must be able to recognize IC cards held 10cm or more from a read/writer while still allowing people to pass through smoothly. If the radio waves are too strong, transmissions emanating from one IC card interfere with transmissions from another person's IC card being used at an adjacent ticket gate leading to erroneous charging. To prevent this, the maximum distance for the transmission of radio waves is 20cm. The FeliCa technology developed to meet these requirements was used in the "Suica" card, which was introduced by East Japan Railway on November 18, 2001. Initially there were problems caused by uncertainty about the way the cards should be used. For example, people held their cards too far away from the reader/writers or kept their Suica cards in wallets with other IC cards. Many of these problems resulted from the fact that this was Japan's first contactless ticketing system and was unfamiliar not only to users, but also to those operating the system. We had to assign specialist staff around the clock to deal with these issues. I was one of them and for about two years after the introduction of the technology, I had to be ready to deal with problems, even on New Year's Day.

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Sony increases production capacity for image sensors including back-illuminated and large sized CMOS image sensors

The following information is true and accurate at the time of publication.
September 1, 2010, Tokyo, Japan - Sony Corporation (hereafter, "Sony") today announced that Sony would invest approximately 40 billion yen into Sony Semiconductor Kyushu Corporation's Kumamoto Technology Center (hereafter, "Kumamoto TEC"), to increase production capacity for "Exmor" and "Exmor R" CMOS image sensors. This investment comprises of an amount previously determined to be invested in the second half of fiscal year 2010, which was included in the forecast for the capital expenditures announced at the earnings announcement for the first quarter ended June 30, 2010, in addition to an amount to be invested in fiscal year 2011.

With this investment, Sony will strengthen its production capacity for image sensors to meet the expected increase in market demand, and continue to solidify its global leadership position in image sensors.

Sony Semiconductor Kyushu Corporation's Kumamoto Technology Center
The recent boom in smartphones is creating demand for devices with high image quality and high sensitivity capabilities. Also, the evolution of lighter and more compact Digital Still Cameras as well as improved camera functionality have resulted in an expanding customer segment who own high quality Digital Single Lens Reflex cameras.
These market conditions have led to greater demand for larger image sensors and image sensors with higher image capabilities.

In order to meet these market demands, Sony currently provides two CMOS image sensor models: "Exmor" , which adopts the "Column-Parallel A/D Conversion Technique", providing each column within the sensor with its own A/D converter to reduce noise; and "Exmor R", which applies a back-illuminated structure to enhance image characteristics through high sensitivity and reduced noise.

Since 2009, Sony has been mass producing "Exmor R" for Digital Still Cameras and Digital Video Camcorders on wafer lines (with diameter of 200mm) at Sony Semiconductor Kyushu Corporation's Nagasaki Technology Center. Furthermore, at the end of this year Sony plans to start the mass production of "Exmor R" on wafer lines (with diameter of 300mm) at Kumamoto TEC for mobile phone and compact Digital Still Camera markets.

With the investment announced today, Kumamoto TEC's CMOS image sensor production capacity will be further increased, and Sony will strengthen its ability to meet the expected market demand for "Exmor R" used in smartphones as well as a wide range of digital imaging products for consumer and professional use, including compact Digital Still Cameras. In addition, Sony will increase production capacity for mainly large sized "Exmor" used in Digital Single Lens Reflex cameras.

Increase production capacity to meet the increasing demand of CMOS image sensorsKumamoto Technology Center, Sony Semiconductor
Kyushu Corporation (Kikuchi-gun, Kumamoto Prefecture)Wafer processing equipment for CMOS image sensor production, etc.From the second half of fiscal year 2010 through fiscal year 2011Production Capacity (Wafer Process/300mm wafers):25,000 wafers per month
(Before investment this time: 18,500 wafers per month)
-Of them, the capacity for image sensors will be 22,500 wafers per month
(Before investment this time: 16,000 wafers per month)
(Total production capacity of Kumamoto TEC Fab 1 and 2)
Outline of Sony Semiconductor Kyushu Corporation2-3-2 Momochihama, Sawara-ku Fukuoka-shi Japan(3) Representative Director (President):24.25 billion yen, fully owned by Sony CorporationKagoshima, Oita, Nagasaki and KumamotoApproximately 9,000 (including contract and temporary employees) as of March 31, 2010Development, design and production of semiconductors, etc.

4000-1 Haramizu, Kikuyomachi Kikuchigun, Kumamoto, JapanImage sensors (CCD and CMOS), micro display devices (H-LCD and "SXRD", etc.)

"Exmor" is a trademark of Sony Corporation.
"Exmor R" is a trademark of Sony Corporation.
"SXRD" is a trademark of Sony Corporation.

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Sony to Realign its LCD TV Manufacturing Operations for Europe<br> - Barcelona Technology Center in Spain to be sold to Ficosa International and COMSA EMTE -

As part of its on-going initiative to enhance its manufacturing efficiency to improve the profitability of its liquid crystal display ("LCD") TV business, Sony Corporation ("Sony") today announced that its relevant European subsidiaries have agreed with Ficosa International, S.A. ("Ficosa") and COMSA EMTE SL ("COMSA EMTE"), both headquartered in Spain, to sell the Barcelona technology center (formal name: Sony Espana S.A., Barcelona Technology Center [Barcelona, Spain]), which manufactures LCD TVs for the Europe region, to Ficosa and COMSA EMTE.

With this transaction, the Barcelona technology center will be divided into two new companies, one focusing on manufacturing and the other focusing on development and engineering. The manufacturing company will be wholly-owned and operated by Ficosa, while the development and engineering company will be a 50:50 joint venture between Ficosa and COMSA EMTE. Between them, the new companies intend to assume employment of the majority of employees at the Barcelona technology center.

Sony will source LCD TV production to the new manufacturing company for two years after completion of the transfer. Both the new manufacturing and engineering companies will concurrently develop new businesses.

The transfer is planned to be completed by the end of December 2010, subject to certain regulatory and other approvals.

Although a loss is expected to be incurred by Sony in connection with the transaction for the rest of the current fiscal year, no material impact is anticipated on Sony's consolidated financial results forecast for the current fiscal year that was released at the time of the first quarter earnings announcement, as such loss has been included in the forecast as a part of the 75 billion yen of estimated restructuring charges.

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3D JOINT VENTURE OF SONY, DISCOVERY COMMUNICATIONS AND IMAX ANNOUNCES KEY MANAGEMENT APPOINTMENTS

(Los Angeles, Calif.) - Julia Rao and Mark Ringwald have joined the 3D joint venture of Sony Corporation, Discovery Communications and IMAX Corporation to launch one of the first 24/7, fully programmed 3D television networks. Rao has been named Chief Financial Officer and Ringwald joins as Director of Scheduling and Acquisitions. The announcement was made by joint venture President and CEO Tom Cosgrove.

"Julia and Mark bring extensive industry experience and incredible enthusiasm to our fast-growing 3D team," said Cosgrove. "By leveraging the unmatched strength and expertise of Sony, Discovery and IMAX, we will establish this network as the leader in 3D with the most extensive library of original and exclusive high-quality 3D content available anywhere."

As Chief Financial Officer, Rao is responsible for strategic planning, financial analysis and budgeting for the joint venture, including forecasting and analysis of all revenue and expenses relating to advertising sales, affiliate sales, programming, marketing, communications, research and staffing. Rao previously served as Chief Financial Officer for several Discovery U.S. networks, including Animal Planet, Planet Green, Discovery Health and FitTV. During that time, she played an integral role in the strategic growth and development of those businesses and had financial oversight over such brand definitional hits as WHALE WARS, RIVER MONSTERS, MONSTERS INSIDE ME, and FATAL ATTRACTIONS. She also served as Senior Director for the network portfolio comprised of Discovery Channel, Science Channel, Military Channel and Investigation Discovery, where she managed program investments for nearly 1,000 hours of original content, including signature series and special events including PLANET EARTH, DIRTY JOBS, MYTHBUSTERS, HOW IT'S MADE and DEADLIEST CATCH. Before joining Discovery, Rao served in consulting capacities at The World Bank and National Science Foundation. She received her MBA from the Robert H. Smith School of Business at the University of Maryland.

As Director of Scheduling and Acquisitions, Ringwald will oversee scheduling and programming strategy for the joint venture, including long-form and short-form program acquisition and long-term programming and scheduling strategy. Most recently, Ringwald served as Vice President of Programming for AmericanLife TV Network, a basic cable family-themed network available in over 13 million U.S. homes. He was responsible for all aspects of the look and content of the network, including acquisitions, scheduling, operations, productions, promotions, traffic and online. During his tenure, he significantly increased original content on the network, and established a vertical program schedule built around "theme nights" that succeeded in driving improved engagement and viewership. He also produced and directed educational programming and documentaries for Educational Television Services. Ringwald is a graduate of Texas Tech University.

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Newly-developed technology facilitates both internal data transmission and power supply with a single cable

The following information is true and accurate at the time of publication.
Sony Corporation ('Sony') has developed 'single wire interface technology', a hybrid transmission technology which facilitates both data and power transmissions through a single cable.
This technology enables the internal wiring of a mobile device to be streamlined through a single cable (copper wire). Conventionally, the video, audio and control signals as well as the power transmission were spread out over several dozen cables within the movable mechanisms of mobile devices, such as hinges or rotating parts. Sony aims to promptly implement this technology to improve design flexibility, reliability and durability for mobile devices with movable mechanisms.
In recent years, mobile devices have become ever more sophisticated in terms of advanced functionality and high resolution displays. As a result, more wiring connections have been used to accommodate the increasing volume of data being transmitted within devices.
Accordingly, new problems began to emerge as connectors in devices became larger and it became more difficult to bend the connecting cables.

Sony's newly-developed 'single wire interface technology' has achieved bi-directional transmission of several kinds of signals, including video, audio and control signals, by using time division duplex and multiplex*1. In addition, the DC power is supplied on the same signal cable. Sony's unique encoding technology*2 with DC balance enables both DC power supply and high speed data to be transmitted within a limited frequency bandwidth.

In order to swiftly begin practical implementation of this technology, Sony has teamed up with ROHM Co., Ltd. ('ROHM'), which has a track record in peripheral technologies, for the joint development and technical validation for the analog portion of the test chip.
Hereafter, Sony will grant ROHM a license for the IP of the digital portion of this newly-developed technology in order to advance the development of a single chip which includes both the analog and digital portions.

*1  Time division duplex and multiplex: A method of digital data transmission using time slot.
It enables bi-directionally transmitting multi-type of data over a single cable.
*2  Multi-level encoding: Encoding from data bits to multi-level code.

1. Time division duplex and multiplex have enabled bi-directional transmission of multiple types of data over a single transmission cable
Sony developed a unique time division duplex and multiplex method that enable packets of data, including video (display, camera), audio, and control signals to be transmitted over a single cable. Furthermore, Sony has enabled the bi-directional transmission of different signals, such as display and camera signals, by incorporating a mechanism that retains individual synchronization.

2. Unique multi-level encoding technology has enabled higher transmission rates within the limited signal frequency bandwidth
The newly-developed hardware is composed of (1) a digital portion that performs multi-level encoding, (2) an analog portion that transmits and receives signals, and (3) another portion that combines signals with DC power or separates signals from DC power. A unique multi-level encoding that has no DC component enables both high speed transmission with limited frequency bandwidth and DC power supply on a single common cable.
Sony has demonstrated that high transmission speeds (940Mbps) can be achieved.

: video (Display / Camera), audio, control signals: 10-80mW (0-940Mbps) during transmission, 0.3mW when on stand-by.*3Power supply voltage for analog IC

*3  excluding the digital section (FPGA)
*4  when using twin coaxial cable #36 with shields

The wiring between the main body of a mobile phone and its display section includes display data, camera data, audio signals, various kinds of sensor data and control data, and a DC power supply. The table below presents a comparison of required wiring for conventional technology, and required wiring for the newly-developed 'single wire interface technology'.

Number or wires when wired using conventional technology Number or wires when wired using this new technology Total number of wires
(comprising the following:)

The above estimates assume the following conditions.
• Screen display: WVGA resolution
Built-in camera on display side: VGA resolution
• Includes audio and DC power wiring.
• Has controls for various sensors (two type) such as the touch panel sensors and receives data.
• Has 4 key switch data acquisition controls and 2 LED flashing controls.

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Sony to Present wide range of 3D Compatible Products and Contents<br> at "CEATEC JAPAN 2010"

TOKYO, JAPAN, October 1, 2010 - Sony Corporation announced today that it will showcase its industry leading 3D products, technologies, and contents at "CEATEC JAPAN 2010" (October 5-9), to be held at Makuhari Messe International Convention Complex in Chiba City.

"3D world created by Sony" will exhibit a complete end-to-end lineup of 3D products and its supporting technologies provided by Sony Group ranging from the 'Lens to the Living Room' including contents creation. It will also introduce a variety of ways for customers to enjoy 3D movies, music videos, games, and photographs.

A 3D compatible LED screen measuring 21.7 meters wide on the main stage (technology reference exhibit) will display various 3D contents including movies, music videos, games and sports. Sony will also introduce solutions for 3D contents creation by installing professional 3D camera systems and 3D compatible broadcasting systems on stage to demonstrate the operation of live 3D public viewing, such as sport events in high quality broadcast.
This will showcase Sony Group's total 3D solution from consumer products to broadcast and professional products to an array of contents.

Sony will connect its vivid 3D compatible Bravia TV (240Hz high frame rate) with LED backlight, together with Blu-ray 3D™ playback compatible Blu-ray Disc Recorder/Player and 3D Theater Stand System, and deliver 3D contents offered by Sony Pictures Entertainment(Japan) Inc. and Sony Music Entertainment(Japan)Inc., to offer attendees with an enjoyable hands on 3D experience.
"Cyber-shot" and "a" (pronounced Alpha) with 3D Sweep Panorama feature will introduce new ways of enjoying personal 3D contents. There will also be personal computer "VAIO" 3D compatible prototype display. Moreover, attendees will be able to enjoy stereoscopic 3D compatible "PlayStation®3" games including "Gran Turismo®5," which will hit the market on November 3, 2010.

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