[UPDATE] Interviews with Engineers - Mercury-free Alkaline Button Battery A Goal Others Dismissed as Impossible

In 2004, Sony succeeded in developing a mercury-free silver oxide button battery, a task that other manufacturers had dismissed as impossible. Five years later in 2009, Sony also announced the development of a mercury-free alkaline button battery. We asked Masatsugu Shiota---a Sony engineer involved in these initiatives---to talk about his experiences in developing these batteries.

Silver oxide batteries and alkaline button batteries have anodes that contain zinc. Corrosive reactions affecting this zinc produce hydrogen gas. In button batteries, this not only reduces output capacity, but also causes pressure to build up within the battery, which can lead to swelling, leakage and other problems. Traditionally, the production of hydrogen gas was suppressed through the use of mercury, which is highly effective in preventing zinc corrosion. Mercury was a panacea that maintained both the performance and safety of batteries.

For this reason, the development of mercury-free batteries was not simply a matter of removing the mercury. Without an alternative "panacea" there would be a heightened risk of hydrogen production. In 2004, Sony was able to create a mercury-free silver oxide battery by developing new technologies to curb corrosive reactions affecting the zinc. Sony also took advantage of the fact that the silver oxide used in the cathode had the capacity to absorb hydrogen. In the mercury-free silver oxide battery, the amount of hydrogen gas produced was dramatically reduced by improving the ability of the zinc to resist corrosion, and any minute amounts of hydrogen gas that were still generated were absorbed by the silver oxide. However, the cathode in an alkaline button battery is made from manganese dioxide. Unlike silver oxide, this material lacks the capacity to absorb hydrogen. This meant that it was impossible to eliminate the mercury from alkaline button batteries.

Our efforts to develop a mercury-free silver oxide battery were initially prompted by growing international concern about the environmental effects of mercury, and the tightening of environmental protection regulations. Everyone thought that button batteries couldn't be made without mercury, and thus they were exempt from regulations. However, we staked Sony's reputation on the early development of a mercury-free silver oxide battery. We couldn't use the same technology to produce a mercury-free alkaline button battery because the cathode wouldn't absorb hydrogen, with the result that there would be an increased risk of swelling and leakage. At the time, even members of the development team were convinced that the development of a mercury-free alkaline button battery was impossible.

Yet the only challenge facing the team was the lack of a substance to absorb any hydrogen gas produced. There was a nagging feeling that somehow this problem could be solved. In addition to our normal work, we began to carry out adhoc research and experiments in our spare time in the hope of discovering a way to address the hydrogen gas issue. The most difficult challenge was finding a suitable material to absorb the gas. We weren't even sure how much hydrogen needed to be absorbed to make the battery safe. So we simply continued to experiment with substances that could absorb hydrogen. In addition to checking individual substances, we also tried combining them to create new substances.

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[UPDATE] Special Interview - Development and Mass-production of World's First OLED TV

In March 2009, Tetsuo Urabe of Sony's Display Device Development Group and three others received the 55th Okochi Memorial Award. These awards are presented to individual researchers and business organizations that have made major contributions to the field of production engineering, including the development of production technology, and the implementation of advanced production methods. The award received by Urabe and his colleagues was in recognition of their work relating to the development and mass-production of the world's first OLED television.

Sony has earned widespread acclaim for its success in the development and mass-production of the world's first OLED television, which follows earlier development successes---the Super Top Emission structure for OLED panels, and the active matrix OLED display.

Sony first became involved in OLED research around 1994. A growing number of organizations had established OLED R&D projects after the publication of a paper in 1987 describing a thin-film OLED device fabricated using vapor deposition. In this sense, Sony was a latecomer to this field. At the time, Trinitron was still Sony's core technology for display devices. Of course, the Company was also working on the development of next-generation flat-panel display devices and had established parallel projects focusing on various types of devices, including the Plasmatron (plasma addressed liquid crystal) and field emission display (FED) systems.

"Various systems were being tried at that time. It was as if they were in competition with each other. There was extensive debate on which technology would be the winner."

Not everyone thought that OLED was likely to become a major future display technology, and the development of display devices based on OLED technology did not begin in earnest until 1998. Tetsuo Urabe was a member of the OLED display development team established that year.

Technology had already been developed to create light using OLED. However, Sony wanted to develop an OLED display for TV use. This achievement would necessitate the creation of a screen made up of large numbers of picture elements. Sony decided to use an active matrix system based on thin-film transistor (TFT) technology, which is also used in LCD panels. The consensus view at the time was that it would be very difficult to apply this technology to the development of an OLED display. However, Urabe and his colleagues began to develop an active matrix driver for an OLED-based system.

"There was growing interest in the concept of an OLED system with an active matrix driver. It was seen as a technology for the future. Sony was a latecomer to OLED R&D, but we were among the first to start developing the technology for use as a television display device."

The first problem in using an active matrix system to drive an OLED display was variation in pixel brightness. This variation results from differences in the characteristics of the TFTs positioned in each pixel.

"In an OLED display, the TFTs drive the luminescence themselves. This means that any variation in TFT characteristics end up as variations in the brightness of individual pixels."

Since creating TFTs with identical characteristics is virtually impossible, Urabe's team decided to focus instead on the development of a method to compensate for this. After studying several possible solutions, they decided to use current mirror circuits.

Current mirror circuits consist of two circuits that are mirror images of each other. When a current flows in one of the circuits, the same exact current will flow through the other one. These circuits were attached to neighboring pixels. Provided both pixels in each pair have the same TFT characteristics, there will be no variation in pixel brightness between them. Using this concept, Urabe's team was able to overcome the brightness variation problem by arranging large numbers of pixels symmetrically. In 2001, they succeeded in developing the world's first 13-inch active matrix OLED display. At the time, it was the largest in the world.

Sony had developed a 13-inch OLED display, but it was still only a prototype. The first challenge on the path to commercialization would be to extend the life of the product. When first developed, the display was completely useless as a commercial product since its brightness declined dramatically in just two or three days. There were countless additional challenges, including the choice of organic materials and drive system and the method used to stack thin organic layers. The development team also had to consider the structure of the organic layers, and the method used to isolate the materials from the external environment. Urabe and his team solved each of these problems in turn by conducting a massive program of testing and evaluation. The work was so intense that team members sometimes fought over access to larger pieces of testing equipment.

The next challenge was the establishment of production technology. Before OLED products could be launched commercially, Sony needed a production technology able to mass-produce panels without any loss of quality. One of the most difficult tasks was reducing the number of defective pixels. The organic film in an OLED panel is only a few hundred nanometers thick. This extremely thin layer is sandwiched between electrodes, and the presence of even a minute particle of dust can prevent the current from flowing to the organic film, resulting in a dead pixel. To prevent dead pixels, it's necessary to eliminate dust, so the team began to remove all possible sources of dust from the production line. They also sought to minimize the effects of dust by increasing the thickness of the film as much as possible without compromising its characteristics. Another solution involved the use of lasers to repair any dead pixels discovered after production.

This process culminated in 2004 with the launch of the Courier PEG-VZ90, the first PDA with an OLED panel.

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[UPDATE] Interviews with Engineers - Cell-The Dream Processor

In addition to its vast processing power, the Cell Broadband Engine™ used in PLAYSTATION 3 also embodies an ambitious vision of a chip that can be used in a wide range of other fields. It resulted from a collaborative development project based in Texas. The project involved Sony, Sony Computer Entertainment, IBM and Toshiba, with talented engineers from each of these four companies working around the clock to develop the new chip. We asked one of the lead engineers on the Cell development team to share his recollections about the project.

We began to develop Cell immediately after the launch of PlayStation 2 in May 2000. Obviously Cell was positioned as the processor for a next-generation computer entertainment system to succeed PlayStation 2, but we started the development project with a much more ambitious concept. We wanted to create a client processor capable of functioning as the nucleus for software interactions between networks and future computers connected to those networks. We also wanted that processor to be capable of functioning as a server. I was involved in most aspects of Cell's development, including not only the establishment of the basic concept, but semiconductor design as well.

When I first heard about the Cell concept, I felt a pure chill of excitement. I joined Sony Computer Entertainment after its establishment, and I've been involved in the development of processors for all three generations of platforms-PlayStation, PlayStation 2 and PLAYSTATION 3. However, the first encounter with a totally new challenge is always an exciting moment for an engineer. I was absolutely thrilled to have this opportunity to work on the development of this dream processor.

Because the concept of networked computing was at the heart of the Cell development project, we began by defining a design philosophy. Rather than starting with the development of hardware IC packaging, we decided to create a Java virtual machine that could be executed directly. We also decided to incorporate an agent-oriented approach into the hardware, in the form of software that would be able to work with peripheral elements while also operating independently. From the outset, we decided that Cell should be a multicore chip with multiple processor cores. Multiprocessor systems with multiple CPUs were already on the market. We debated until the last possible moment about whether Cell should be a homogenous multicore system with multiple cores based on the same specifications, or a heterogeneous multicore system containing multiple cores with different specifications. The use of multiple processors based on the same specification would increase the complexity of some elements, including the cache system and memory management. This approach would also result in higher costs, since it would be necessary to incorporate these elements for each processor. In contrast, an architecture with multiple processors operating separately under a single processor dedicated to memory management would simplify memory management and provide robust security. This approach would also result in a simpler structure for the multiple processors and allow a smaller package area, thereby helping to reduce costs. After considering these advantages, we ultimately decided on a heterogeneous multicore specification consisting of one PowerPC Processor Element (PPE) and eight Synergistic Processor Elements (SPE).

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[UPDATE] Special Interview - Transforming Advanced Japanese Technology, such as FeliCa and QR Code, into International Standards

International standards and technical standards play an extremely important role in the commercialization of technology and the development of new products that offer enhanced added value for users. In addition to the development of technology, Sony has also focused its efforts on standardization initiatives. This policy reflects the company's determination to provide enhanced benefits to consumers by effectively incorporating the added value created by technology into a wide range of products and services. Setsuo Harada, who heads Sony's Standards and Partnership Department, has earned widespread recognition for his contributions to the development of international standards based on advanced Japanese technology, including technology for contactless IC cards, such as FeliCa, and the QR Code. In October 2008, he received the 2008 Prime Minister's Award for the Industrial Standardization Project.

In the past, many Japanese companies, including Sony, excelled in the strategy known as "de facto standardization." Their approach was to create products far more attractive than those of their competitors, enabling them to win such overwhelming market share that their products gained recognition as unofficial standards. However, it is becoming increasingly apparent in recent years that this no longer ensures survival in either domestic or overseas markets. The turning point came in 1995, when Japan signed the Agreement on Technical Barriers to Trade (the TBT Agreement). Adopted by the World Trade Organization (WTO), the TBT Agreement requires that existing international standards be adopted as national standards wherever appropriate. Its purpose is to prevent the evaluation procedures used to ensure compliance in individual countries from becoming barriers to global trade caused by the proliferation of different standards. Under the Agreement on Government Procurement, which was also introduced by the WTO, international standards must also be applied to industrial products procured by government agencies. These changes ensured that companies ignoring international standards could no longer gain large shares of international or even domestic markets.

Harada first became involved in Sony's international standardization activities in 1991. In 1992, he established the Technology Standards Committee with the support and encouragement of then Deputy President Ken Iwaki. Standardization organizations were subsequently formed in the United States in 1992 and in Europe in 1993. Sony now had an international standardization structure spanning Japan, North America and Europe.

"No other company in the world had an organization like this," recalls Harada. At that time, most companies in Japan and throughout the world relied on de facto standards to attain market share. However, Harada had already concluded that de facto standards would not guarantee survival in the 21st century and was among the first to recognize the importance of international de jure standards established by international standardization organizations. He established an internal organization to coordinate Sony's response and began to visit departments within Sony to raise awareness of the importance of international standards. Harada's vision of the 21st century steadily gained acceptance throughout the Sony.

One of the most notable examples of Sony's international standardization efforts relates to the Near Field Communication (NFC) technology that it developed in collaboration with Philips Semiconductor (now NXP Semiconductors). The FeliCa contactless IC card technology, which is used in passenger ticketing systems, including East Japan Railway's Suica system, and e-money systems, such as Edy, is a subset of NFC technology. The use of contactless IC cards had been increasing gradually until the technology was adopted by East Japan Railway for its Suica system a few years ago. Since then the pace of adoption has been extremely rapid. FeliCa technology is currently used not only in the Suica and Edy systems, but in a variety of other contactless IC card applications. However, this success would not have been possible if Sony had not been granted an international standard for its technology.

Because of the WTO Agreement on Government Procurement, FeliCa needed to be recognized as an international standard before East Japan Railway could adopt it for its contactless IC card system. Unfortunately, Sony was forced to abandon its attempt to register FeliCa as an international standard for contactless IC cards, in part because of opposition from European companies. Harada refused to give up, however, and instead tried another approach. He decided to seek approval for FeliCa as a standard not for contactless IC cards, but for Near Field Communication (NFC) technology. This time he was successful, and the way was open for East Japan Railway to adopt FeliCa. Harada's determination to gain approval for FeliCa as an international standard was driven by his awareness that adoption by East Japan Railway would be more significant than its adoption by an ordinary company.

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[UPDATE] Interviews with Engineers - Semiconductor Lasers the Key to High Storage Densities on Blu-ray Discs

Blue-violet semiconductor lasers are used to read digital signals from Blu-ray discs, and the commercial development of Blu-ray products would not have been possible without this core component device. Thanks to determined efforts by its engineers, Sony was able to complete development of the laser within a very tight schedule in time to start the mass-production of millions of PLAYSTATION 3 consoles, the first product to incorporate Blu-ray technology.

During my time with Sony, I have been involved in the development of semiconductor lasers for optical discs, including CD, DVD and BD systems. For me the most exciting achievement, and one that required enormous effort, was the development of the blue-violet semiconductor laser.

A semiconductor laser is to an optical disc what a needle is to an analog record. The surface of an optical disc is covered with minute pits (concave areas) and ridges (convex areas). By bouncing laser beams off these areas and reading information contained in the reflected light, we can play back the content recorded on the disc. If we reduce the wavelength of the laser beam, the spot diameter of the laser is also reduced, allowing us to use smaller pits and ridges on the disc. By recording data using a laser with a short wavelength, we can store more information within the same disc area. The development of semiconductor lasers with progressively shorter wavelengths has driven the evolution of optical discs, from CDs to DVDs, and now to BDs. The laser used when playing a music CD has a wavelength of 780nm (nm=nanometer), while a DVD requires a 650nm red laser. Because the red laser used to write DVDs has a shorter wavelength, the capacity of DVDs is correspondingly greater. To create the BD, which has around five times more recording capacity than a DVD, we needed to develop a blue-violet laser capable of producing light with an even shorter wavelength.

The development of blue lasers began in the 1980s. Despite the efforts of engineers in many countries, the development of suitable materials was a slow process. Semiconductor lasers emit light when an electrical current is passed through the semiconductor used. To discover suitable materials for semiconductor lasers, we need to find combinations of substances that will produce laser light with the desired wavelength when current passes through them.

Initially Sony tried to develop a semiconductor laser using materials based on zinc selenide, and in 1996 we succeeded in maintaining continuous oscillation for 100 hours. However, Sony changed its development strategy after Nichia Corporation succeeded in developing a gallium nitride semiconductor laser with a shorter wavelength. It was a difficult decision to abandon development of the materials that we had previously been researching. However, we wanted Sony to maintain its leading role in the advancement of optical disc technology, and we saw this as the best decision in terms of ensuring that Sony would be the first to develop next-generation products based on BD technology.

Yet at this stage, we had simply selected the material that we would use. There were still many challenges to overcome before we could turn this into a semiconductor laser that could be used in commercial products. The first of these was the solution of problems surrounding Nichia Corporation's patents relating to gallium nitride. In the second half of the 1990s, there was a patent lawsuit between Nichia Corporation and Toyoda Gosei Co., Ltd. concerning a blue LED made using gallium nitride. There was extensive media coverage about the blue LED that couldn't be marketed because of the patent dispute. Urgent steps were needed to resolve this problem so that Sony could introduce its blue-violet semiconductor laser. However, Nichia Corporation took the position that it would sell products but not the technology, and that it would opt for licensing if there were complementing technologies. Fortunately, Sony had laser manufacturing patents, expertise and commercialization experience dating back to the CD era. We also had manufacturing facilities with world-class technology, including Sony Shiroishi Semiconductor Inc. (Sony Shiroishi), the Sony's Group's semiconductor laser manufacturer.

We negotiated persistently with Nichia Corporation for four-and-a-half years, with strong backing from the Patent Department and other units. This hard work eventually paid off, and we reached the conclusion that the quickest way to bring commercial products to market was to link Sony's semiconductor laser manufacturing technology with Nichia Corporation's basic patents for gallium nitride. In late 2002, the two companies began to collaborate on the development of a blue-violet semiconductor laser for use in optical disc applications. In April 2004, we signed a cross-licensing agreement relating to patents for a blue-violet semiconductor laser.

I was absolutely determined to develop a semiconductor laser for use in BD products. We had an unbroken history of involvement in the optical disc business. That heritage began with basic research carried out in the 1960s by a previous generation of Sony engineers and continued through to the commercialization of the CD products in the 1980s, and then to the DVD era. I could not allow that history to end, and I had to keep working until we ultimately achieved success. Both the product engineers and the device (parts) engineers were also determined to ensure that Sony would lead the development of a next-generation optical disc to succeed the DVD.

My commitment to the development project became even stronger because of the presence of another standard that was competing with Blu-ray for dominance in the next-generation optical disc market. Our determination to popularize BD technology as quickly as possible drove us to overcome the many obstacles that lay in our path.

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[UPDATE] Interviews with Engineers - The World's First Products Made from Vegetable-based Plastics

Sony has been a pioneer in the development of plastics made from vegetable-based materials and has led the electronics industry in the use of vegetable-based plastics to manufacture product cases. How were these vegetable-based plastics developed? We asked one of the engineers involved to talk about the background of these materials and the challenges encountered on the path to their development.

My background is polymer research. Some examples of my work include the development of materials for optical disc substrates, tape media and materials supporting the creation of intricate patterns on semiconductor chips. I first encountered and began to evaluate polylactic acid around 1990. Polylactic acid was seen as a promising material, and I was examining its potential for products. I subsequently began to carry out research relating to aspects of environmental technologies, including material recycling, lead-free solders and water pollution prevention technology. At the heart of Sony's environmental technology is the concept of using materials derived from biomass (plants) in products. Past successes include the use of limonene (a type of oil extracted from oranges) to facilitate the recycling of styrene foam, and the use of biomass-based carbon as electrode material. After discussions among our research team members, we decided to research whether or not polylactic acid could be used in products built to be highly durable. Around 1998, we began to work toward this goal in earnest.

Polylactic acid has a long history and has been used widely in the manufacture of biodegradable plastics. Unfortunately, it is fragile, vulnerable to heat and inflexible, making it unsuitable for creating product casings. It also requires special care to prevent degradation during use.

To use polylactic acid in the manufacture of product casings, we knew we'd have to overcome all these problems. However, our research team members were all professionals with excellent problem-solving skills and extensive experience in the enhancement of physical properties. We were confident we could overcome the challenges. Through continued trial and error, we discovered that aluminum hydroxide could be used to make the material fire-resistant, and that strength and durability could be improved by adding rubber and a hydrolysis regulator. We also found that excellent malleability could be achieved by adding pigments. The result was a vegetable-based plastic that met quality conditions for use in products. At the time, not even industrial material manufacturers were aware of the potential of polylactic acid for use in creating product casings.

A new Walkman launched by Sony in 2002 was the world's first product with a casing made from vegetable-based plastics. The most difficult aspect of our work on this product was not the development of the vegetable-based plastic, but the process leading up to its use in actual products. Because these materials had never been used before, our product developers had many doubts and concerns. We visited them repeatedly to brief them about the importance of using vegetable-based plastics and convince them of their suitability by showing them data relating to their reliability, cost, suitability for mass-production and other factors. This can perhaps be characterized as a process of changing perceptions within Sony.

Color reproduction characteristics represented another challenge. When the pigments added were changed for each color, the physical properties of the materials also changed. When no suitable pigment was available, we had to find one through a repeated trial-and-error. For each color, we also assessed the material to ensure that it met the required quality standard. In some cases it was very difficult to reproduce the stipulated color accurately, but eventually we were able to achieve the colors sought by the designers.

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[UPDATE] Mercury-free Alkaline Button Battery

There are many types of batteries. Primary (disposable) batteries (such as dry-cell and button batteries) are used once and discarded. Secondary (rechargeable) batteries (which include lithium-ion varieties) can be recharged and used repeatedly. Solar cells represent yet another type of battery. Conventionally, button batteries contain mercury to prevent the generation of hydrogen gas. However, the use of mercury is not without risks. The improper use or disposal of mercury-based batteries carries adverse risks for both the environment and human health. Yet, developing technology necessary to create mercury-free button batteries was an extremely difficult challenge. Sony's commitment to reducing its environmental impact is a reflection of its unrelenting efforts to meet that challenge, and in 2004 it succeeded in developing the world's first mercury-free silver oxide battery. In 2009, Sony achieved what was regarded as an even more difficult task: the development of technology leading to the world's first mercury-free alkaline button battery.

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[UPDATE] Dye-sensitized Solar Cells

Sony has been involved in developing technology for dye-sensitized solar cells for several years. Dye-sensitized solar cells are next-generation solar cells based on innovative technology. Unlike conventional silicon-based solar cells, dye-sensitized solar cells consist primarily of photosensitive dye and other substances. Dye-sensitized solar cells are able to generate electricity by converting energy from light absorbed by the dye. Since these solar cells can be produced from low-cost materials using simple manufacturing processes (such as coating and printing), overall manufacturing expenditures are expected to be comparatively low. Other advantages over silicon-based solar cells include the ability to use a variety of designs and colors and achieve high performance under indoor and low light settings. In addition, changes in the angle at which light hits the surface of the cells have minimal effect on performance. Such dye-sensitized solar cell advantages are expected to expand the range of use for solar cells, which are ideal for a variety of consumer-related applications in which conventional solar cells are unsuitable.

Sony commenced R&D in this field in 2001. In April 2009, a prototype module based on Sony's unique "Concerto Effect" dye-mixing technology set a world record for a dye-sensitized solar cell by achieving energy conversion efficiency of 8.4%. Aiming to launch commercial products in the near future, Sony has accelerated efforts to enhance the photovoltaic (light to electric energy conversion) efficiency and reliability of these cells and develop effective manufacturing processes.

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[UPDATE] Interviews with Engineers - 35mm Full-size CMOS Sensor

Equipped with the 35mm full-size CMOS sensor providing 24.6 effective megapixels, the a900 is Sony's flagship model for its a Series digital single lens reflex (DSLR) cameras. This camera was developed to meet the demands of photographers who want to take pictures with the same focal length and angle of field as can be achieved with 35mm film cameras. The CMOS sensor built into the a900 gives this camera the ability to capture subjects in minute detail. The imaging element has approximately 2.35 times the area of an APS-C size CMOS sensor, empowering photographers to create images with enhanced definition. The creators of this enlarged cutting-edge sensor had to overcome many challenges on the road to its development. We asked one of the engineers who worked on the sensor about the difficulties involved.

Our greatest challenge during the initial stages of development was controlling processing precision. Any loss of processing precision will cause color and sensitivity variations in a CMOS sensor. If you increase the size of a CMOS sensor, you also increase the risk of horizontal and vertical imperfections, and it becomes proportionately more difficult to maintain the necessary processing precision. However, some aspects of optical characteristics, such as color variations, do not become apparent until you actually produce a sensor. So we had to go through repeated cycles of simulation checking and prototype creation until we developed a sensor supporting the kind of imaging quality we were seeking.

Yield was a major issue at the manufacturing stage. The dominant factor influencing yield was the presence of sub-micron particles. Although the clean room in the manufacturing plant provides extremely advanced dust protection, the density of the imaging elements and the circuits and wiring around them is so high, that a single particle falling onto a sensor can short out the circuitry and render the element useless. We tend to think of particles as things that float around in the air, but in fact they can appear in unexpected places. For example, particles are sometimes produced when materials are transported.

We decided to design circuits that would be less vulnerable to particles. This approach was based on a concept known as "design for manufacturing" (DFM). DFM is a circuit design technology that takes into account problems arising from manufacturing technology. We devised an element and wiring layout for a full-sized CMOS sensor that allowed us to reduce vulnerability to particles from the design stage. A lot of effort went into production line improvements. For example, we installed production equipment made from materials that were less likely to produce particles. These measures brought about gradual improvements in yields.

During APS-C size sensor development, we also carried out manufacturing simulations for a full-size CMOS sensor, and we had a general idea of what to expect because of our work on pixel design, specification development and other aspects. However, when we took photographs with the prototype sensor, we noticed a problem. Noise that was imperceptible with an APC-C sensor was significantly expanded and became much more obvious.

A full-size CMOS sensor has a larger photosensitive area than an APS-C CMOS sensor, and care must be taken to ensure compatibility between the area around the field and the optical system. Light traveling through the center lens reaches the CMOS sensor in a roughly vertical direction. However, light that passes through peripheral areas of the lens follows a slanting path to the lens. This results in reduced sensitivity, color variation and other phenomena. To solve this problem, we reduced the distance to the photodiodes to ensure that peripheral light would also reach the image sensor, and we also improved the overall flatness of the chip. In a full-size chip, even minute differences in light wavelengths can cause major color variations, so enhancing flatness has remained an important priority.

This process required exquisite artisanship. The slightest change to the processing conditions would radically alter the characteristics of the chip. When the conditions were right, however, the chip seemed to respond to our efforts. It was as if we were working with a living thing.

Our goal was not to achieve optimal characteristics on a pinpoint basis, but rather to achieve the same characteristics consistently. This was extremely important from a manufacturing perspective. Our efforts to meet this requirement would result not only in manufacturing parameter adjustments, but also in major modifications to the entire manufacturing process.

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[UPDATE] Interviews with Engineers - Creating an IC Card with Optimal Security and Ease of Use

Sony's FeliCa provides enhanced security while also supporting high-speed data transmission and reception. Its creators had to overcome many challenges, including the development of an IC card without a built-in battery, and the implementation of reliable security measures.

The development of fundamental technologies supporting FeliCa began in 1988 after a major logistics firm approached Sony to develop an IC card system that would make the automatic sorting of packages a reality. Initially the developers decided to create a system that would use wireless technology to transmit unique IDs assigned to each package. The sorting system would read these IDs and sort packages by destination.

However, when a prototype tag capable of transmitting an ID was first engineered, the developers found that it would require not only an IC chip but also a thin laminated battery to supply power, as well as an antenna and various other components. The total cost was over 2,000 yen per unit. At this price, the tag would not have been suitable for use in managing a logistics environment where thousands of items need to be tracked. So, Sony was forced to abandon the idea of using the technology in a sorting system based on IC cards.

However, Sony continued to develop IC cards based on wireless technology. A key priority was solving the power supply problem, which had frustrated efforts to develop a logistics system for package deliveries. The CPU on an IC card needs electric power to operate, but a thin laminated battery would be too expensive. So Sony's engineers decided to use a reactive transmission system based on field-effect transistors (FETs), which have minimal power requirements.

Conventional transistors establish circuits by controlling the current outflow in relation to the input current. As long as conventional transistors are used, the circuits only exist while power is present. However, FETs produce signals by varying the input voltage. This allows them to establish operating circuits with infinitesimal amounts of power. With FET technology, it is possible to transmit data simply by modifying the resistance.

Today's FeliCa card has no battery, but at the time, the card still required an internal power source. However, these new advances opened the doors to development of an IC card that would operate using far less power than the original system design. The adoption of the FET approach in analog circuitry was a major step forward to the practical implementation of the FeliCa concept.

The development of FeliCa reached a major turning point in 1988. In that year, we learned that the JR Group's Railway Technical Research Institute was conducting studies on a ticketing system based on the use of IC cards. We thought it might be possible to use Sony's IC card technology in such a system, so we presented the Railway Technical Research Institute with our technological findings. However, the specifications required by the Institute were higher than we anticipated. They wanted a system capable of processing 60 people through a ticket gate per minute and a transmission time of 200ms or lower. The IC card we were developing at the time would not have been able to meet these requirements.

Another requirement stipulated by the Railway Technical Research Institute was that the IC card must operate without a battery. We had succeeded in reducing the card's power consumption, but we had not developed a totally batteryless card. However, we were aware that the number of cards used by a full-scale ticketing system adopted by the JR Group would be extremely large. Both JR and Sony reached the conclusion that a card without an internal power supply would be the ideal solution. This conclusion was based not only practical considerations, such as thickness and battery life, but also on environmental considerations, including the need to avoid the release of toxic substances at the time of disposal. Our first step toward the creation of a batteryless card was to switch to non-volatile memory (EPROM). By using the 13.56MHz frequency, on which it is legally permissible to transmit electric power, we were able to create a system capable of supplying power from the reader/writer without contact. The advantages of an IC card based on FET technology now became apparent. Because Sony had reduced the power requirements of its IC card by using FETs, it was relatively easy to create a card without an internal power supply.

The effective distance stipulated for radio waves emitted by an IC card is at least 10cm and no more than 20cm. Ticket gates are used by large numbers of people, and the system must be able to recognize IC cards held 10cm or more from a read/writer while still allowing people to pass through smoothly. If the radio waves are too strong, transmissions emanating from one IC card interfere with transmissions from another person's IC card being used at an adjacent ticket gate leading to erroneous charging. To prevent this, the maximum distance for the transmission of radio waves is 20cm. The FeliCa technology developed to meet these requirements was used in the "Suica" card, which was introduced by East Japan Railway on November 18, 2001. Initially there were problems caused by uncertainty about the way the cards should be used. For example, people held their cards too far away from the reader/writers or kept their Suica cards in wallets with other IC cards. Many of these problems resulted from the fact that this was Japan's first contactless ticketing system and was unfamiliar not only to users, but also to those operating the system. We had to assign specialist staff around the clock to deal with these issues. I was one of them and for about two years after the introduction of the technology, I had to be ready to deal with problems, even on New Year's Day.

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Sony increases production capacity for image sensors including back-illuminated and large sized CMOS image sensors

The following information is true and accurate at the time of publication.
September 1, 2010, Tokyo, Japan - Sony Corporation (hereafter, "Sony") today announced that Sony would invest approximately 40 billion yen into Sony Semiconductor Kyushu Corporation's Kumamoto Technology Center (hereafter, "Kumamoto TEC"), to increase production capacity for "Exmor" and "Exmor R" CMOS image sensors. This investment comprises of an amount previously determined to be invested in the second half of fiscal year 2010, which was included in the forecast for the capital expenditures announced at the earnings announcement for the first quarter ended June 30, 2010, in addition to an amount to be invested in fiscal year 2011.

With this investment, Sony will strengthen its production capacity for image sensors to meet the expected increase in market demand, and continue to solidify its global leadership position in image sensors.

Sony Semiconductor Kyushu Corporation's Kumamoto Technology Center
The recent boom in smartphones is creating demand for devices with high image quality and high sensitivity capabilities. Also, the evolution of lighter and more compact Digital Still Cameras as well as improved camera functionality have resulted in an expanding customer segment who own high quality Digital Single Lens Reflex cameras.
These market conditions have led to greater demand for larger image sensors and image sensors with higher image capabilities.

In order to meet these market demands, Sony currently provides two CMOS image sensor models: "Exmor" , which adopts the "Column-Parallel A/D Conversion Technique", providing each column within the sensor with its own A/D converter to reduce noise; and "Exmor R", which applies a back-illuminated structure to enhance image characteristics through high sensitivity and reduced noise.

Since 2009, Sony has been mass producing "Exmor R" for Digital Still Cameras and Digital Video Camcorders on wafer lines (with diameter of 200mm) at Sony Semiconductor Kyushu Corporation's Nagasaki Technology Center. Furthermore, at the end of this year Sony plans to start the mass production of "Exmor R" on wafer lines (with diameter of 300mm) at Kumamoto TEC for mobile phone and compact Digital Still Camera markets.

With the investment announced today, Kumamoto TEC's CMOS image sensor production capacity will be further increased, and Sony will strengthen its ability to meet the expected market demand for "Exmor R" used in smartphones as well as a wide range of digital imaging products for consumer and professional use, including compact Digital Still Cameras. In addition, Sony will increase production capacity for mainly large sized "Exmor" used in Digital Single Lens Reflex cameras.

Increase production capacity to meet the increasing demand of CMOS image sensorsKumamoto Technology Center, Sony Semiconductor
Kyushu Corporation (Kikuchi-gun, Kumamoto Prefecture)Wafer processing equipment for CMOS image sensor production, etc.From the second half of fiscal year 2010 through fiscal year 2011Production Capacity (Wafer Process/300mm wafers):25,000 wafers per month
(Before investment this time: 18,500 wafers per month)
-Of them, the capacity for image sensors will be 22,500 wafers per month
(Before investment this time: 16,000 wafers per month)
(Total production capacity of Kumamoto TEC Fab 1 and 2)
Outline of Sony Semiconductor Kyushu Corporation2-3-2 Momochihama, Sawara-ku Fukuoka-shi Japan(3) Representative Director (President):24.25 billion yen, fully owned by Sony CorporationKagoshima, Oita, Nagasaki and KumamotoApproximately 9,000 (including contract and temporary employees) as of March 31, 2010Development, design and production of semiconductors, etc.

4000-1 Haramizu, Kikuyomachi Kikuchigun, Kumamoto, JapanImage sensors (CCD and CMOS), micro display devices (H-LCD and "SXRD", etc.)

"Exmor" is a trademark of Sony Corporation.
"Exmor R" is a trademark of Sony Corporation.
"SXRD" is a trademark of Sony Corporation.

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Sony to Realign its LCD TV Manufacturing Operations for Europe<br> - Barcelona Technology Center in Spain to be sold to Ficosa International and COMSA EMTE -

As part of its on-going initiative to enhance its manufacturing efficiency to improve the profitability of its liquid crystal display ("LCD") TV business, Sony Corporation ("Sony") today announced that its relevant European subsidiaries have agreed with Ficosa International, S.A. ("Ficosa") and COMSA EMTE SL ("COMSA EMTE"), both headquartered in Spain, to sell the Barcelona technology center (formal name: Sony Espana S.A., Barcelona Technology Center [Barcelona, Spain]), which manufactures LCD TVs for the Europe region, to Ficosa and COMSA EMTE.

With this transaction, the Barcelona technology center will be divided into two new companies, one focusing on manufacturing and the other focusing on development and engineering. The manufacturing company will be wholly-owned and operated by Ficosa, while the development and engineering company will be a 50:50 joint venture between Ficosa and COMSA EMTE. Between them, the new companies intend to assume employment of the majority of employees at the Barcelona technology center.

Sony will source LCD TV production to the new manufacturing company for two years after completion of the transfer. Both the new manufacturing and engineering companies will concurrently develop new businesses.

The transfer is planned to be completed by the end of December 2010, subject to certain regulatory and other approvals.

Although a loss is expected to be incurred by Sony in connection with the transaction for the rest of the current fiscal year, no material impact is anticipated on Sony's consolidated financial results forecast for the current fiscal year that was released at the time of the first quarter earnings announcement, as such loss has been included in the forecast as a part of the 75 billion yen of estimated restructuring charges.

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3D JOINT VENTURE OF SONY, DISCOVERY COMMUNICATIONS AND IMAX ANNOUNCES KEY MANAGEMENT APPOINTMENTS

(Los Angeles, Calif.) - Julia Rao and Mark Ringwald have joined the 3D joint venture of Sony Corporation, Discovery Communications and IMAX Corporation to launch one of the first 24/7, fully programmed 3D television networks. Rao has been named Chief Financial Officer and Ringwald joins as Director of Scheduling and Acquisitions. The announcement was made by joint venture President and CEO Tom Cosgrove.

"Julia and Mark bring extensive industry experience and incredible enthusiasm to our fast-growing 3D team," said Cosgrove. "By leveraging the unmatched strength and expertise of Sony, Discovery and IMAX, we will establish this network as the leader in 3D with the most extensive library of original and exclusive high-quality 3D content available anywhere."

As Chief Financial Officer, Rao is responsible for strategic planning, financial analysis and budgeting for the joint venture, including forecasting and analysis of all revenue and expenses relating to advertising sales, affiliate sales, programming, marketing, communications, research and staffing. Rao previously served as Chief Financial Officer for several Discovery U.S. networks, including Animal Planet, Planet Green, Discovery Health and FitTV. During that time, she played an integral role in the strategic growth and development of those businesses and had financial oversight over such brand definitional hits as WHALE WARS, RIVER MONSTERS, MONSTERS INSIDE ME, and FATAL ATTRACTIONS. She also served as Senior Director for the network portfolio comprised of Discovery Channel, Science Channel, Military Channel and Investigation Discovery, where she managed program investments for nearly 1,000 hours of original content, including signature series and special events including PLANET EARTH, DIRTY JOBS, MYTHBUSTERS, HOW IT'S MADE and DEADLIEST CATCH. Before joining Discovery, Rao served in consulting capacities at The World Bank and National Science Foundation. She received her MBA from the Robert H. Smith School of Business at the University of Maryland.

As Director of Scheduling and Acquisitions, Ringwald will oversee scheduling and programming strategy for the joint venture, including long-form and short-form program acquisition and long-term programming and scheduling strategy. Most recently, Ringwald served as Vice President of Programming for AmericanLife TV Network, a basic cable family-themed network available in over 13 million U.S. homes. He was responsible for all aspects of the look and content of the network, including acquisitions, scheduling, operations, productions, promotions, traffic and online. During his tenure, he significantly increased original content on the network, and established a vertical program schedule built around "theme nights" that succeeded in driving improved engagement and viewership. He also produced and directed educational programming and documentaries for Educational Television Services. Ringwald is a graduate of Texas Tech University.

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Newly-developed technology facilitates both internal data transmission and power supply with a single cable

The following information is true and accurate at the time of publication.
Sony Corporation ('Sony') has developed 'single wire interface technology', a hybrid transmission technology which facilitates both data and power transmissions through a single cable.
This technology enables the internal wiring of a mobile device to be streamlined through a single cable (copper wire). Conventionally, the video, audio and control signals as well as the power transmission were spread out over several dozen cables within the movable mechanisms of mobile devices, such as hinges or rotating parts. Sony aims to promptly implement this technology to improve design flexibility, reliability and durability for mobile devices with movable mechanisms.
In recent years, mobile devices have become ever more sophisticated in terms of advanced functionality and high resolution displays. As a result, more wiring connections have been used to accommodate the increasing volume of data being transmitted within devices.
Accordingly, new problems began to emerge as connectors in devices became larger and it became more difficult to bend the connecting cables.

Sony's newly-developed 'single wire interface technology' has achieved bi-directional transmission of several kinds of signals, including video, audio and control signals, by using time division duplex and multiplex*1. In addition, the DC power is supplied on the same signal cable. Sony's unique encoding technology*2 with DC balance enables both DC power supply and high speed data to be transmitted within a limited frequency bandwidth.

In order to swiftly begin practical implementation of this technology, Sony has teamed up with ROHM Co., Ltd. ('ROHM'), which has a track record in peripheral technologies, for the joint development and technical validation for the analog portion of the test chip.
Hereafter, Sony will grant ROHM a license for the IP of the digital portion of this newly-developed technology in order to advance the development of a single chip which includes both the analog and digital portions.

*1  Time division duplex and multiplex: A method of digital data transmission using time slot.
It enables bi-directionally transmitting multi-type of data over a single cable.
*2  Multi-level encoding: Encoding from data bits to multi-level code.

1. Time division duplex and multiplex have enabled bi-directional transmission of multiple types of data over a single transmission cable
Sony developed a unique time division duplex and multiplex method that enable packets of data, including video (display, camera), audio, and control signals to be transmitted over a single cable. Furthermore, Sony has enabled the bi-directional transmission of different signals, such as display and camera signals, by incorporating a mechanism that retains individual synchronization.

2. Unique multi-level encoding technology has enabled higher transmission rates within the limited signal frequency bandwidth
The newly-developed hardware is composed of (1) a digital portion that performs multi-level encoding, (2) an analog portion that transmits and receives signals, and (3) another portion that combines signals with DC power or separates signals from DC power. A unique multi-level encoding that has no DC component enables both high speed transmission with limited frequency bandwidth and DC power supply on a single common cable.
Sony has demonstrated that high transmission speeds (940Mbps) can be achieved.

: video (Display / Camera), audio, control signals: 10-80mW (0-940Mbps) during transmission, 0.3mW when on stand-by.*3Power supply voltage for analog IC

*3  excluding the digital section (FPGA)
*4  when using twin coaxial cable #36 with shields

The wiring between the main body of a mobile phone and its display section includes display data, camera data, audio signals, various kinds of sensor data and control data, and a DC power supply. The table below presents a comparison of required wiring for conventional technology, and required wiring for the newly-developed 'single wire interface technology'.

Number or wires when wired using conventional technology Number or wires when wired using this new technology Total number of wires
(comprising the following:)

The above estimates assume the following conditions.
• Screen display: WVGA resolution
Built-in camera on display side: VGA resolution
• Includes audio and DC power wiring.
• Has controls for various sensors (two type) such as the touch panel sensors and receives data.
• Has 4 key switch data acquisition controls and 2 LED flashing controls.

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Sony to Present wide range of 3D Compatible Products and Contents<br> at "CEATEC JAPAN 2010"

TOKYO, JAPAN, October 1, 2010 - Sony Corporation announced today that it will showcase its industry leading 3D products, technologies, and contents at "CEATEC JAPAN 2010" (October 5-9), to be held at Makuhari Messe International Convention Complex in Chiba City.

"3D world created by Sony" will exhibit a complete end-to-end lineup of 3D products and its supporting technologies provided by Sony Group ranging from the 'Lens to the Living Room' including contents creation. It will also introduce a variety of ways for customers to enjoy 3D movies, music videos, games, and photographs.

A 3D compatible LED screen measuring 21.7 meters wide on the main stage (technology reference exhibit) will display various 3D contents including movies, music videos, games and sports. Sony will also introduce solutions for 3D contents creation by installing professional 3D camera systems and 3D compatible broadcasting systems on stage to demonstrate the operation of live 3D public viewing, such as sport events in high quality broadcast.
This will showcase Sony Group's total 3D solution from consumer products to broadcast and professional products to an array of contents.

Sony will connect its vivid 3D compatible Bravia TV (240Hz high frame rate) with LED backlight, together with Blu-ray 3D™ playback compatible Blu-ray Disc Recorder/Player and 3D Theater Stand System, and deliver 3D contents offered by Sony Pictures Entertainment(Japan) Inc. and Sony Music Entertainment(Japan)Inc., to offer attendees with an enjoyable hands on 3D experience.
"Cyber-shot" and "a" (pronounced Alpha) with 3D Sweep Panorama feature will introduce new ways of enjoying personal 3D contents. There will also be personal computer "VAIO" 3D compatible prototype display. Moreover, attendees will be able to enjoy stereoscopic 3D compatible "PlayStation®3" games including "Gran Turismo®5," which will hit the market on November 3, 2010.

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Sony to Realign its LCD TV Manufacturing Operations for Europe

As part of its on-going initiative to enhance its manufacturing efficiency to improve the profitability of its liquid crystal display ("LCD") TV business, Sony Corporation ("Sony") today announced that its relevant European subsidiaries have agreed with Ficosa International, S.A. ("Ficosa") and COMSA EMTE SL ("COMSA EMTE"), both headquartered in Spain, to sell the Barcelona technology center (formal name: Sony Espana S.A., Barcelona Technology Center [Barcelona, Spain]), which manufactures LCD TVs for the Europe region, to Ficosa and COMSA EMTE.

With this transaction, the Barcelona technology center will be divided into two new companies, one focusing on manufacturing and the other focusing on development and engineering. The manufacturing company will be wholly-owned and operated by Ficosa, while the development and engineering company will be a 50:50 joint venture between Ficosa and COMSA EMTE. Between them, the new companies intend to assume employment of the majority of employees at the Barcelona technology center.

Sony will source LCD TV production to the new manufacturing company for two years after completion of the transfer. Both the new manufacturing and engineering companies will concurrently develop new businesses.

The transfer is planned to be completed by the end of December 2010, subject to certain regulatory and other approvals.

Although a loss is expected to be incurred by Sony in connection with the transaction for the rest of the current fiscal year, no material impact is anticipated on Sony's consolidated financial results forecast for the current fiscal year that was released at the time of the first quarter earnings announcement, as such loss has been included in the forecast as a part of the 75 billion yen of estimated restructuring charges.

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Sony Participates in 2010 United Nations Private Sector Forum on the Millennium Development Goals

Sony Corporation (Sony) affirms its continued commitment to helping achieve the Millennium Development Goals (MDGs) through use of its advanced technology, human and intellectual capital, and global reach, and through innovative and collaborative public/private partnerships.

In support of this effort, on September 22, Dr. Ryoji Chubachi, Vice Chairman, Sony Corporation, will participate in the 2010 United Nations (UN) Private Sector Forum on the Millennium Development Goals chaired by UN Secretary-General Ban Ki-moon and including approximately 300 Heads of State and Government, chief executives, civil society leaders and Heads of UN Agencies.

Under the theme "For the Next Generation", Sony works actively to contribute to the realization of a sustainable society. Most recently, a key aspect of Sony's participation in the 2010 FIFA World Cup™, where it was an Official FIFA Partner, was the launch of a social contribution program called "Dream Goal 2010." This program was designed to combine Sony's unique technological and human resources with the power of football to bring people together, help address multiple social challenges, and inspire hopes and dreams in children.

Specifically, Sony partnered with the United Nations Development Programme (UNDP), the Japan International Cooperation Agency (JICA) and a number of nongovernmental organizations (NGOs) to implement a variety of projects aimed at building a better future for Africa and its children. These projects included the staging of public viewing events in Cameroon and Ghana that enabled approximately 24,000 people who do not have access to television to experience World Cup matches, live, on large screens, in connection with HIV/AIDS education, counseling and testing. More than 4,800 people were tested for HIV over the course of the program, more than 2.5 times the goal set at the start of the initiative.

In Ghana, Sony also piloted a new, portable open energy system* capable of capturing, storing and distributing electricity from renewable energy sources, which powered public viewing screens. This system, if successful, has the potential to contribute to major improvements in people's lives in terms of health, education, economic well-being and overall way of life, particularly in developing nations.

Other projects in Sony's FIFA World Cup™ program included the Siyakhona ( "We can do it") project, through which the Company donated its products to NGOs around the world to help children capture their surrounding environment and everyday life through photography and communicate it to the world at large, and the Ticket Fund, which enabled Sony, in partnership with a local NGO, to bring 15,000 South African children who had participated in HIV/AIDS awareness programs to FIFA World Cup™ matches.

Building on these and other initiatives, Sony will continue to apply its products, services, technologies and expertise creatively to innovate new ways of contributing to the achievement of MDGs. Sony hopes that, through international and local partnerships, it can and will help change the lives of communities around the world.

To learn more about Sony Group's MDGs and Dream Goal 2010 related activities, refer to:
http://www.sony.net/dreamgoal
http://www.sony.net/SonyInfo/csr/ForTheNextGeneration/contentslist/saml/index.html

* The open energy system prototype named "GEO System" has been jointly developed by Sony Computer Science Laboratories and Sony Energy Devices Corporation.

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TransferJet Consortium to showcase its technology at "CEATEC JAPAN 2010"

The following information is true and accurate at the time of publication.

The TransferJet Consortium will present a special booth at "CEATEC JAPAN 2010" (October 5-9, 2010) held at Makuhari Messe in Chiba City, on the outskirts of Tokyo.
At this booth, the TransferJet Consortium members will be demonstrating products, prototypes, components, semiconductors, software, test equipment and certification programs associated with the TransferJet ecosystem. Visitors will be able to see the possibilities offered by this unique "touch transfer" wireless technology, such as how consumers can transfer and share content among devices inside and outside the home.

The consortium will present its activities including international standardization efforts and future developments.It will demonstrate TransferJet wireless technology through its member's products which employ the technology. This includes transferring photos between cameras, sending photos to printers, storing content on network servers, and displaying pictures on TVs and picture frames. It will also reveal future service concepts, such as content downloading from kiosks as well as new application proposals incorporating mobile phones, PCs and STBs (Set Top Boxes).Participating companies: I-O DATA DEVICE, INC., KDDI Corporation, NTT DOCOMO, INC.,Seiko Epson Corporation, Sony Corporation, Sony Ericsson Mobile Communications and Toshiba CorporationSystem and Component TechnologyNewly-developed 2nd-generation LSI and modules for TransferJet technologyMemory cards incorporating TransferJet functionalityA wide selection of miniature, high-performance couplersHardware/software development tools and solutionsParticipating companies: ADVANEX INC., E-Globaledge Corporation, Hitachi Ltd.(Hitachi Cable, Ltd.) , Murata Manufacturing Co., Ltd., NISSEI ELECTRIC CO., LTD., SMK Corporation, Sony Corporation, TAIYO YUDEN CO., LTD., Tateno Dennou, Inc., TOKO, INC., TOTOKU Electric Co., Ltd. and Toshiba CorporationCertification related TechnologyTest Equipment used for the compliance testing and certification programIntroduction of the certification test labs and their activitiesParticipating companies: Agilent Technologies Japan, Ltd., Allion Test Labs, Inc., XXCAL Japan Inc.
The TransferJet Consortium was established in 2008 by a group of international companies with the common goal of developing the technology, products and services based on TransferJet wireless technology. The consortium focuses on the development of specifications, compliance testing processes and tools, as well as conduct marketing activities to promote the TransferJet concept, technology, products, applications and services. Additional information about the consortium, its participating companies and membership information is available at: http://www.transferjet.org/en/. * denotes companies demonstrating in the booth (20 companies)

Canon Inc.
CASIO COMPUTER CO.,LTD.
Eastman Kodak Company
Hitachi Ltd. *
JVC KENWOOD Holdings, Inc.
KDDI Corporation *
NIKON CORPORATION
NTT DOCOMO, INC. *
Olympus Imaging Corporation
Panasonic Corporation
Pioneer Corporation
SAMSUNG ELECTRONICS CO., LTD.
Seiko Epson Corporation *
SHARP CORPORATION
SOFTBANK MOBILE Corp.
Sony Corporation *
Sony Ericsson Mobile Communications *
Toshiba Corporation *

ADVANEX INC. *
Agilent Technologies Japan, Ltd. *
Allion Test Labs, Inc. *
Askey Computer Corp.
Cambridge Silicon Radio Limited
CyberLink Corporation
d-broad, Inc.
E-Globaledge Corporation *
FUJIFILM Corporation
Fujitsu Limited
Funai Electric Co., Ltd.
Hosiden Corporation
HOYA CORPORATION
I-O DATA DEVICE, INC. *
Japan Circuit Co., Ltd.
KYOSHIN TECHNOSONIC Co., Ltd.
MediaTek Inc.
Murata Manufacturing Co., Ltd. *
NEC Corporation
NHK Media Technology, Inc
NISSEI ELECTRIC CO., LTD. *
NKB.INC
RICOH Co., Ltd.
Seers Technology Co., Ltd
SK Telesys Co., Ltd.
SMK Corporation *
TAIYO YUDEN CO., LTD. *
Tateno Dennou, Inc. *
Theoria Communications Inc.
TOKO, INC. *
TOTOKU Electric Co., Ltd. *
Tyco Electronics Japan G.K.
Ubiquitous Corporation
XXCAL Japan Inc. *

* TransferJet regular typeface and TransferJet logos are trademarks of Sony Corporation.

Media Contact from here

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"Sony Disc & Digital Solutions Inc." to be Renamed "Sony DADC Corporation"

Since launching the world's first music Compact Disc in 1982, Sony has continued to leverage its advanced disc technologies to deliver new and revolutionary digital solutions for the music, movie, and game industries, including formats such as Blu-ray Disc (BD), CD, DVD and UMD across a wide range of platforms. These businesses are operated in the Americas by Sony DADC Americas, Sony DADC International in Europe and Asia Pacific, and in Japan by Sony DADC Japan. As an integral element of the Sony DADC group of companies, the primary focus of Sony DADC Corporation is to perform critical business planning functions for Sony's global pre-recorded optical disc business and to pursue development of mass-production technologies and equipment as well as value-added technologies for the optical disc business.

Going forward, Sony DADC Corporation will continue to drive Sony's optical disc business forward by striving for further technological innovation while offering the same levels of quality and service across all areas of it business and operations.

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Sony increases production capacity for image sensors including back-illuminated and large sized CMOS image sensors

The following information is true and accurate at the time of publication.
September 1, 2010, Tokyo, Japan - Sony Corporation (hereafter, "Sony") today announced that Sony would invest approximately 40 billion yen into Sony Semiconductor Kyushu Corporation's Kumamoto Technology Center (hereafter, "Kumamoto TEC"), to increase production capacity for "Exmor" and "Exmor R" CMOS image sensors. This investment comprises of an amount previously determined to be invested in the second half of fiscal year 2010, which was included in the forecast for the capital expenditures announced at the earnings announcement for the first quarter ended June 30, 2010, in addition to an amount to be invested in fiscal year 2011.

With this investment, Sony will strengthen its production capacity for image sensors to meet the expected increase in market demand, and continue to solidify its global leadership position in image sensors.

Sony Semiconductor Kyushu Corporation's Kumamoto Technology Center
The recent boom in smartphones is creating demand for devices with high image quality and high sensitivity capabilities. Also, the evolution of lighter and more compact Digital Still Cameras as well as improved camera functionality have resulted in an expanding customer segment who own high quality Digital Single Lens Reflex cameras.
These market conditions have led to greater demand for larger image sensors and image sensors with higher image capabilities.

In order to meet these market demands, Sony currently provides two CMOS image sensor models: "Exmor" , which adopts the "Column-Parallel A/D Conversion Technique", providing each column within the sensor with its own A/D converter to reduce noise; and "Exmor R", which applies a back-illuminated structure to enhance image characteristics through high sensitivity and reduced noise.

Since 2009, Sony has been mass producing "Exmor R" for Digital Still Cameras and Digital Video Camcorders on wafer lines (with diameter of 200mm) at Sony Semiconductor Kyushu Corporation's Nagasaki Technology Center. Furthermore, at the end of this year Sony plans to start the mass production of "Exmor R" on wafer lines (with diameter of 300mm) at Kumamoto TEC for mobile phone and compact Digital Still Camera markets.

With the investment announced today, Kumamoto TEC's CMOS image sensor production capacity will be further increased, and Sony will strengthen its ability to meet the expected market demand for "Exmor R" used in smartphones as well as a wide range of digital imaging products for consumer and professional use, including compact Digital Still Cameras. In addition, Sony will increase production capacity for mainly large sized "Exmor" used in Digital Single Lens Reflex cameras.

Increase production capacity to meet the increasing demand of CMOS image sensorsKumamoto Technology Center, Sony Semiconductor
Kyushu Corporation (Kikuchi-gun, Kumamoto Prefecture)Wafer processing equipment for CMOS image sensor production, etc.From the second half of fiscal year 2010 through fiscal year 2011Production Capacity (Wafer Process/300mm wafers):25,000 wafers per month
(Before investment this time: 18,500 wafers per month)
-Of them, the capacity for image sensors will be 22,500 wafers per month
(Before investment this time: 16,000 wafers per month)
(Total production capacity of Kumamoto TEC Fab 1 and 2)
Outline of Sony Semiconductor Kyushu Corporation2-3-2 Momochihama, Sawara-ku Fukuoka-shi Japan(3) Representative Director (President):24.25 billion yen, fully owned by Sony CorporationKagoshima, Oita, Nagasaki and KumamotoApproximately 9,000 (including contract and temporary employees) as of March 31, 2010Development, design and production of semiconductors, etc.

4000-1 Haramizu, Kikuyomachi Kikuchigun, Kumamoto, JapanImage sensors (CCD and CMOS), micro display devices (H-LCD and "SXRD", etc.)

"Exmor" is a trademark of Sony Corporation.
"Exmor R" is a trademark of Sony Corporation.
"SXRD" is a trademark of Sony Corporation.

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Sony announces "Video On Demand powered by Qriocity™" extending into Europe<br> Also announces plans for "Music Unlimited powered by Qriocity™" cloud-based music service

Berlin, Germany - In November 2009, Sony Corporation (Sony) said that it was developing a network service platform called Sony Online Services (SOLS), which is now called Qriocity™. Qriocity is a network service platform that connects many of Sony's network-enabled devices and allows consumers to enjoy high quality entertainment across multiple devices. Via Qriocity, Sony will deliver a variety of digital entertainment content and services that are "powered by Qriocity", including video, music, game applications, and e-books over time, and through these services, and in combination with its networked devices, Sony aims to bring new and exciting entertainment experiences to customers.

Today at the IFA 2010 show in Berlin, Sony announced that "Video On Demand powered by Qriocity™", a premium streaming video service, will be available this fall in five European countries including France, Germany, Italy, Spain and the U.K. With "Video On Demand powered by Qriocity," customers can choose from hundreds of box office hits from 20th Century Fox Home Entertainment, Lionsgate, Metro-Goldwyn-Mayer Studios Inc. (MGM), NBC Universal International Television Distribution, Paramount Pictures, Sony Pictures Home Entertainment, The Walt Disney Company, and Warner Bros. Digital Distribution, as well as popular content from top local studios. Many movies are available in High Definition (HD) as well as Standard Definition (SD), and all can be rented at the touch of a button on Sony's 2010 models of network-enabled BRAVIA® TVs and Blu-ray Disc™ players, and Blu-ray Home Theater systems. "Video On Demand powered by Qriocity" has been available in the U.S. since April 2010.

Sony also announced plans to introduce "Music Unlimited powered by Qriocity™", a new, cloud-based, digital music service. Available by year's end, "Music Unlimited powered by Qriocity" will give music lovers access to millions of songs stored and synchronized through the cloud. "Music Unlimited powered by Qriocity" will initially be available across Sony's 2010 models of network-enabled BRAVIA TVs, Blu-ray Disc players, Blu-ray Home Theater systems , as well as PlayStation®3 computer entertainment systems and VAIOs and other personal computers, and will become increasingly available on a range of Sony's portable devices.

"Music Unlimited powered by Qriocity" brings together the features cited as most important by music enthusiasts. With access to a huge library of songs through the cloud, users can discover new music through channels personalized to their tastes on multiple devices and without the requirement to manage digital music files. The convenience resulting from this new consumer music experience will further enhance the value of music, thus creating new opportunities for the industry. Details of the service plan will be announced in the future.

"We are excited to offer our customers high quality, cloud-based entertainment experiences across many of Sony's network-enabled devices," said Kazuo Hirai, President of Networked Products & Services Group, Sony Corporation. "Services 'powered by Qriocity' will revolutionize the way that users play, listen, watch, share, communicate, learn, discover and create their digital entertainment content."

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Commercialization and the Start of Mass Production of the SP100 Series, Solar Cell Conductive Film Capable of Making Strings at Low Temperature for Photovoltaic Modules

[New Product]  September 2, 2010Sony Chemical & Information Device Corporation commercialized and commenced full-scale mass production of the SP100 Series, Solar Cell Conductive Film for photovoltaic modules in April 2010. The SP100 Series is a film-type conductive bonding material that bonds the solar cell with the metal ribbon that acts as a transmission line for electricity generated by the cell and, compared with conventional soldering (200°C or more), is capable of low-temperature bonding at 180°C, enabling significant reductions in residual stress after bonding on cells, thereby contributing to improved yield during module production. In addition, the SP100 Series is also capable of bonding thin cells (approximately 150 µm) that are weaker against thermal stress during soldering than standard thick cells. Free of materials that may impact on the environment such as flux and lead, the SP100 Series has been designed with the aim of alleviating the environmental impact after disposal.

Solar cell strings, which compose photovoltaic modules, are generally bonded by soldering which requires heating to a temperature of 200°C or higher. Differences in the thermal and mechanical characteristics of the silicon used in cells and metal ribbon (generally solder-coated copper wire) cause residual stress around the bonding area, leading to problems such as cell breakage after bonding.

Sony Chemical & Information Device’s SP100 Series is a bonding material that uses Anisotropic Conductive Film (ACF) technology utilized for applications such as the mounting of a driver IC on an LCD panel. The SP100 series makes stable contact between the solar cell and metal ribbon by heating and pressurizing conductive particles distributed evenly into the epoxy-type resin, resulting in heat-curing of the resin simultaneously, so the material provides reliable conduction equivalent to that provided by soldering. In addition, because the material is a film type, there is no dispersal of material to the light receiving area, resulting in a module with beautifully finished bonded areas. Moreover, the material is suitable for narrow areas, capable of usage at widths as small as approximately 1mm, making it possible to ensure a wide light-receiving area by reducing the busbar width.

The SP100 Series is not only features a bonding mechanism that renders the melting of solder unnecessary, but also is a bonding material with minimal impact on the environment thanks to the absence of constituents such as flux and Pb. This bonding material is compatible with Pb-free solder-type ribbons and contributes to the production of modules that are even more environmentally-friendly.

The SP100 Series has been evaluated by the Consortium for Development and Assessment of Highly-reliable Photovoltaic Modules of the Advanced Industrial Science and Technology (AIST) and modules using the SP100 Series have passed high-temperature / high-humidity testing (85°C / 85%RH, 1000 hours) and temperature cycle testing (-40°C – 85°C, 200 cycles) regulated by IEC61215, an international module accreditation standard, and it has been verified that the product provides the long-term conduction reliability required by photovoltaic modules.

Test Vehicle

Damp heat test: 85°C / 85%RHThermal cycle test: -40°C to 85°C

Conductive film
Lamination conditionsTemperature(°C)*1Main bonding conditionsTemperature(°C)*1*1 Temperature of conductive film lamination and main bonding: It is not equipment temperature, but temperature of conductive film.*2 Pressure of conductive film lamination: It is discribed as the area of conductive film lamination.*3 Time of conductive film lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target.*4 Pressure of main bonding: The pressure of main bonding is discribed as the bonding area.?Connecting conditions may differ depending on cell size and cell thickness.The SP200 Series, a product capable of bonding at even lower temperatures (160°C) and the metal-ribbon-integrated DT100 Series are scheduled to be exhibited at the 25th European Photovoltaic Solar Energy Conference and Exhibition (25th EU PVSEC) to be held at the Feria Valencia in Spain from September 6 (Monday) to 10 (Friday) this year. Sony Chemical & Information Device CorporationRepresentative: Takashi Ichinose, Representative Director and PresidentHeadquarters: Gate City Osaki, East Tower 8th Floor, 1-11-2 Osaki, Shinagawa-ku, Tokyo, JapanPrincipal operations: Manufacturing and sales of electronics parts, adhesive materials and optical materials,
manufacturing of magnetic disks, magnetic devices, print media and LAMINATE Click here for inquiries related to this matter

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